Fanless Thin Mini-ITX Case for Intel® LGA1700
- Premium aluminium fanless CPU cooling design
- LGA1700 only
- Supports one serial port
- One internal 2.5'' SSD/HDD bay
- Ideal for business and education environments
- Optional 120W or 150W external power adapter (not included)
Premium Brushed Aluminium
Premium aluminium case for hi-heat dissipation and durability. Brushed finish for a sleek and stylish look.
Intel® LGA1700 Ready
Perfect for the Intel® Alder Lake processors up to 35W Thermal Design Point (TDP) with increased contact surface area, allowing for more heat to be dissipated at a time.
Superb Cooling Performance
Completely silent mini PC case, including hi-efficient passive thermal module and copper heat pipes, utilise all aluminium fanless CPU cooling design which acts as a heatsink to dissipate the heat to the surrounding.
Supports Vesa mounting allowing for a more efficient use of space and neater looking environment.